Display device

ABSTRACT

An LCD device is disclosed, which may include display panel and a hard coating layer on the display panel from a photo curable resin composition that includes a fluorinated polymer, wherein the fluorinated polymer is included into the photo curable resin composition by about 15 to about 35 wt %.

This application is a Divisional of application Ser. No. 14/556,729filed on Dec. 1, 2014, which claims the benefit of Korean PatentApplication Nos. 10-2014-0080483, filed on Jun. 30, 2014 and10-2014-0167525, filed on Nov. 27, 2014, the disclosures of which arehereby incorporated by reference for all purposes as if fully set forthherein.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to relates to a display device, and moreparticularly to a display device that includes a hard coating layer.

Discussion of the Related Art

Nowadays, the display field has seen a rapid development for visuallyrepresenting electrical information signals due to the wide spread ofinformation society. A variety of flat panel display devices have beendeveloped with such features as slimness, lightweight and low powerconsumption. Flat panel display devices have been rapidly replacing theexisting cathode ray tubes (CRTs).

Examples of flat panel display devices are liquid crystal display (LCD)devices, organic light emitting display (OLED) devices, electrophoreticdisplay (electric paper display (EPD)) devices, plasma display paneldevices (PDPs), field emission display (FED) devices,electroluminescence display devices (ELDs), electro-wetting display(EWD) devices, and so on.

Such a display device typically includes a hard coating film, in orderto protect its surface and prevent a glaring phenomenon which is causedby external light irradiated onto its display screen. The hard coatingfilm applied to the related art display device can provide ananti-reflective property. To this end, the hard coating layer accordingto the related art includes ultra-fine protrusion patterns with a nanosize that are obtained by prominently and depressively treating itssurface. As such, the hard coating layer can use diffused reflections ofthe ultra-fine protrusion patterns with the nano-size.

However, manufacture cost for forming nano-sized patterns in the hardcoating film is high. Also, an etching process is limited to selectedmaterials, and it is thus difficult to apply the etching process to avariety of materials. Moreover, because the surface of the hard coatingfilm is patterned, it is difficult to form the hard coating film with ahigh hardness. If the hardness is lowered, it is difficult for the hardcoating film to protect the screen of the display device.

The hard coating film according to the related art can be prepared bystacking a plurality of coating layers. The plurality of coating layerscan be formed by one of dry and wet methods.

In case of the dry method using vacuum equipment, a hard coating layeris formed on a base film before high and low refractive-index layers areformed with being overlapped with each other several times. Afingerprint resistant coating layer, which has a fingerprint resistantproperty, can also be formed on the hard coating film already providedwith the plurality of coating layers as needed.

When the hard coating film according to the related art is manufacturedwith the dry method, multiple layer formation processes must be thusperformed to form the plurality of coating layers. Due to this, themanufacture cost of the hard coating film largely increases, themanufacture procedure of the hard coating film becomes complicated, andproductivity of the hard coating film deteriorates. For example, inorder to manufacture the hard coating film according to the related artusing the dry method, six layers may be sequentially formed one by one,requiring multiple deposition or coating processes. Due to this, themanufacture procedure for the hard coating film is very complicated, thequantity and size of the base film are limited depending on the usedvacuum equipment, and process time is lengthened.

In case of the wet method such as a dip or roll coating method, a hardcoating layer and a low refractive-index layer are sequentially formedon a base film. In other words, at least two layers including the hardcoating layer must be formed on the base film. Similar to the drymethod, a fingerprint resistant coating layer, which has a fingerprintresistant property, can also be formed on the hard coating film alreadyprovided with the plurality of coating layers as needed.

The wet method for manufacturing the hard coating film according to therelated art relatively may weaken an adhesion force between the lowrefractive-index layer and the hard coating layer. Also, the lowrefractive-index layer may have a low hardness due to materialproperties. In other words, the wet method may make the combination ofresin compositions forming the hard coating layer and the lowrefractive-index layer become poor. As such, the low refractive-indexlayer and the hard coating layer may be easily separated from eachother.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to a display device andmethod for manufacturing the same that substantially obviates one ormore of the problems due to limitations and disadvantages of the relatedart.

An advantage of the present invention is to provide a display devicewith a hard coating layer that is adapted to enhance an anti-reflectionproperty and omit an additional finger resistant coating layer when afinger resistant property is needed.

Another advantage of the present invention is to provide a displaydevice with a hard coating layer that is adapted to simplify thefabrication procedure and reduce the process time and costs.

Additional features and advantages of the invention will be set forth inthe description which follows, and in part will be apparent from thedescription, or may be learned by practice of the invention. These andother advantages of the invention will be realized and attained by thestructure particularly pointed out in the written description and claimshereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purposeof the present invention, as embodied and broadly described, a displaydevice may, for example, include a display panel; and a hard coatinglayer on the display panel, the hard coating layer including afluorinated polymer that comprises a compound unit represented byChemical Formula 8:

wherein the ‘d’ is one of integers of 1 to 10, the ‘e’ is one ofintegers of 0 to 10, ‘x’ is an integer of at least 1, and the ‘R11’ isan alkyl with hydrogen or carbon atoms of 1 to 4.

In another aspect of the present invention, a method for manufacturing adisplay device may, for example, include forming a display panel; andforming a hard coating layer on the display panel from a photo curableresin composition that includes a fluorinated polymer that comprises acompound unit represented by Chemical Formula 8:

wherein the ‘d’ is one of integers of 1 to 10, the ‘e’ is one ofintegers of 0 to 10, ‘x’ is an integer of at least 1, and the ‘R11’ isan alkyl with hydrogen or carbon atoms of 1 to 4.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate embodiments of the invention andtogether with the description serve to explain the principles of theinvention.

In the drawings:

FIG. 1 is a cross-sectional view illustrating a display device accordingto the first embodiment of the present invention;

FIGS. 2 and 3 are cross-sectional views illustrating examples of adisplay panel of the display device according to the first embodiment ofthe present invention;

FIG. 4 is a cross-sectional view illustrating a display device accordingto the second embodiment of the present invention;

FIG. 5 is a cross-sectional view illustrating a display device accordingto a third embodiment of the present invention; and

FIGS. 6 and 7 are views illustrating a touch panel of the display deviceaccording to the third embodiment of the present invention.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Reference will now be made in detail to embodiments of the presentinvention, examples of which are illustrated in the accompanyingdrawings. The same reference numbers may be used throughout the drawingsto refer to the same or like parts.

A display device according to the first embodiment of the presentinvention will now be explained with reference to FIGS. 1 to 3.

FIG. 1 is a cross-sectional view illustrating a display device accordingto the first embodiment of the present invention. FIGS. 2 and 3 arecross-sectional views illustrating examples of a display panel of thedisplay device according to the first embodiment of the presentinvention.

Referring to FIG. 1, the display device according to the firstembodiment of the present invention includes a display panel 300. Thedisplay device also includes a hard coating layer 100 disposed on thedisplay panel 300.

The hard coating layer 100 disposed on the display panel 300 is formedin a single layer structure. Also, the hard coating layer 100 may beformed from a photo curable resin composition. The photo curable resincomposition in a liquid phase may be coated by a coating apparatus. Inother words, the hard coating layer 100 may be formed by coating thephoto curable resin composition on the display panel 300. Any one ofwell-known coating methods can be used to form the hard coating layer100.

The photo curable resin composition may include a fluorinated polymerand a fluorine based silane. Also, the photo curable resin compositionmay include a cage type silsesquioxane resin. Further, the photo curableresin composition may include chain type siloxane-acrylate. Stillfurther, the photo curable resin composition may include aphoto-polymerization initiator and an acrylic monomer. Furthermore, thephoto curable resin composition may include an organic solvent.

In detail, the photo curable resin composition may include a fluorinatedpolymer. The fluorinated polymer may be formed from urethane acrylate.In other words, the fluorinated polymer may be a urethane-modifiedpolymer. Such a fluorinated polymer may include a compound which isrepresented by the following chemical formula 8.

In chemical formula 8, ‘d’ is one of integers of 1 to 10 and ‘e’ is oneof integers of 0 to 10. Also, ‘R11’ is an alkyl with the hydrogen orcarbon atoms of 1 to 4, and ‘x’ is an integer of at least 1. Thefluorinated polymer may have a molecular weight of about 1000 to 10000.

The fluorinated polymer may be included into the photo curable resincomposition by about 15 to about 35 wt %, when the photo curable resincomposition corresponds to 100 wt %. Such a fluorinated polymer mayenable the hard coating layer 100 to have low reflexibility and apollution resistant property. Also, the fluorinated polymercorresponding to the urethane-modified polymer may enable the hardcoating layer 100 to have elasticity and high hardness.

Still further, the photo curable resin composition may include afluorinated silane. The fluorinated silane may include a compound whichis represented by the following chemical formula 9.

In chemical formula 9, ‘f’ is one of integers of 0 to 10 and ‘g’ is oneof integers of 1 to 10. Also, ‘R12’ through ‘R14 each becomes one ofalkyls with the carbon number of 1 to 4.

The fluorinated silane may be included into the photo curable resincomposition by about 10 to about 15 wt % when the photo curable resincomposition corresponds to 100 wt %. Such fluorinated silane can enablethe hard coating layer 100 to simultaneously have low reflexibility anda pollution resistant property. In other words, the fluorinated silanelowers the refractive index of the hard coating layer 100 so that thehard coating layer 100 has a low reflective property.

The following table 1 shows experiment results for the hard coatinglayer 100 formed on the display panel 300 according to an embodiment ofthe present invention. The experiment results show reflectance,transmittance and haze of the hard coating layer depending on variousmole fractions of fluorine.

TABLE 1 Mole ratio of fluorine Reflectance (%) Transmittance (%) Haze 72.48 93.82 0.33 14 2.08 94.08 0.38 17 1.95 93.95 0.35 20 1.92 94.26 0.2823 1.88 94.21 0.29 25 1.79 94.27 0.28

Referring to table 1, the mole fraction of fluorine included in thephoto curable resin composition can be in a range between 17 and 25 whenthe mole fraction of the photo curable resin composition is 100. If themole fraction of fluorine is lower than 17, the reflectance of the hardcoating layer 100 becomes relatively higher. On the other hand, if themole fraction of fluorine is higher than 25, it becomes difficult tocoat the hard coating layer 100.

As the equipment for measuring the reflectance, a spectrophotometer ofmodel number CM-2600D manufactured by Konica Minolta Inc. is used. A D65standard light source is used as a light source, and an angle of anobserver is set to be about 2 degrees. The reflectance measurement canbe performed after a black adhesive tape manufactured by Toyohozai Co.Ltd. is attached to an entire surface of the hard coating layer 100except a coating surface.

Because the photo curable resin composition includes the fluorinatedpolymer and the fluorinated silane, the hard coating layer 100 can havea low reflection property. In detail, the hard coating layer 100 canhave a reflectance below about 6%.

The photo curable resin composition including the fluorinated polymerand the fluorinated silane enables the hard coating layer 100 to have awater repellent property. As such, the contact angle between the hardcoating layer 100 and water can be more than about 100°. For example,the contact angle may be in a range between about 100° and 130°.

Further, the cage type silsesquioxane resin may be included in the photocurable resin composition. The cage type silsesquioxane resin can berepresented by the following chemical formula 1.[R₁—SiO_(3/2)]_(n)  [Chemical formula 1]

In chemical formula 1, the ‘n’ is one of integers from 6 to 18.Preferably, ‘n’ is set to 12. The cage type silsesquioxane resin can beformed in a hexagonal structure as represented by the following chemicalformula 2.

In chemical formulas 1 and 2, ‘R1’ through ‘R9’ each includes any oneselected from materials which are represented by the following chemicalformulas 3 through 6.

In chemical formulas 3 through 6, ‘m’ is one of integers from 1 to 20and ‘R10’ becomes any one of aliphatic and aromatic hydrocarbons eachhaving the number of carbon atoms corresponding to 1 to 80.

If the photo curable resin composition corresponds to 100 wt % (weightpercent), about 10 to about 20 wt % of cage type silsesquioxane resinmay be included into the photo curable resin composition. As such, thecage type silsesquioxane resin enables the hard coating layer to have ahigh hardness.

In order to protect the display device, the hard coating layer 100disposed on the display panel 300 is to have a high hardness. As such,the hard coating layer 100 may have a pencil hardness of at least 6H.For example, the hard coating layer 100 may be formed to have a pencilhardness of about 6H to about 9H. The pencil hardness can be obtained byplacing a sample of a fabricated hard coating layer 100 under thetemperature of 25° C. and the relative humidity of 60% during two hoursand then measuring the hardness of the sample using a testing pencilregulated in JIS S 6006 datasheet according to a pencil hardness testingmethod regulated in JIS K 5400 datasheet. In this manner, the hardcoating layer 100 of the display device includes the cage typesilsesquioxane resin in the photo curable resin composition. As such,the display device can include the hard coating layer 100 with a highhardness.

Also, chain type siloxane acrylate may be included into the photocurable resin composition. The chain type siloxane acrylate may includea compound which is represented by the following chemical formula 7.

In chemical formula 7, ‘a’ is one of integers of 0 to 1000, ‘b’ is oneof integers of 1 to 30, and ‘c’ is one of integers of 1 to 25.

In case the chain type siloxane acrylate is included into the photocurable resin composition, about 2 to about 4 wt % of the chain typesiloxane acrylate may be included into the photo curable resincomposition %, when the photo curable resin composition corresponds to100 wt %. The chain type siloxane acrylate can be used as a fingerprintresistant additive. In other words, the chain type siloxane acrylate mayenable the hard coating layer 100 to have a fingerprint resistantproperty.

When the hard coating layer 100 needs the fingerprint resistantproperty, the photo curable resin composition may further include thechain type siloxane acrylate. As such, the hard coating layer 100according to an embodiment of the present disclosure can remove anadditional or separate anti-fingerprint layer. In other words, the hardcoating layer 100 can have the fingerprint resistant property eventhough it is formed in a single layer structure.

In order to protect the display device, the hard coating layer 100formed on the display panel 300 may need a water repellent function,which allows a water-drop stained on the hard coating layer to run downwithout being absorbed into the display panel, and a fingerprintresistant function which allows the hard coating layer 100 to be notstained with any fingerprint. As such, if the hard coating layer 100does not have the fingerprint resistant property, it may be necessaryfor an additional or separate anti-fingerprint layer with thefingerprint resistant property.

The display device according to an embodiment of the present inventionincludes the hard coating layer 100, which has the fingerprint resistantproperty, is formed in a single layer structure. As such, an additionalor separate anti-fingerprint layer may be removed from the displaydevice. Therefore, the fabrication procedure can be simplified and theprocess cost and time can be reduced.

Also, the photo curable resin composition may include a photopolymerization initiator. As an example of the photo polymerizationinitiator, any known initiator in the art can be used. The photopolymerization initiator may include at least one selected from amaterial group which includes a hydroxy ketone-based photopolymerization initiator, an amino ketone-based and a hydrogenabstraction type photo polymerization initiator.

For example, the photo polymerization initiation may include any oneselected from a material group which includes2-methyl-1-[4-(methylthio)phenyl]-2-mopholinepropanone-1,diphenylketonebenzyldimethylketal, 2-hydroxy-2-methyl-1-phenyl-1-one,4-hydroxycyclophenylketone, dimethoxy-2-phenylacetophenone,anthraquinone, fluorene, triphenylamine, carbazole,3-methylacetonephenone, 4-chloroacetophenone, 4,4-dimethoxyacetophenone,4,4-diaminobenzophenone, 1-hydroxycyclohexylphenylketone, benzophenoneand mixtures thereof. However, the present invention is not limited tothe above-mentioned photo polymerization initiators. In other words, thephoto curable resin composition may include one of well-known photopolymerization initiators.

When the photo curable resin composition corresponds to 100 wt %, thephoto polymerization initiator may be included into the photo curableresin composition by about 1 to about 3 wt %. The content of the photopolymerization initiator may depend on the hardening speed of the photocurable resin composition and whether or not the photo curable resincomposition is over hardened.

The photo curable resin composition may further include an acrylicmonomer. The acrylic monomer may be a (meth) acrylate monomer. Theacrylic monomer may be included in the photo curable resin composition,in order to enhance the hardness of the curling property of the hardcoating layer 100.

Such an acrylic monomer may include any one selected from a materialgroup which includes dipentaerythritol penta/hexa(meth)acrylate,pentaerythritol tri/tetra(meth)acrylate, ditrimethylolpropanetetra(meth)acrylate, (meth)acrylic ester, trimethylolpropanetri(meth)acrylate, glycerol tri(meth)acrylate,tris(2-hydroxyethyl)isocyanurate, tri(meth)acrylate, ethyleneglycoldi(meth)acrylate, propyleneglycol (meth)acrylate, 1,3-butanedioldi(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanedioldi(meth)acrylate, neopentylglycol di(meth)acrylate, diethyleneglycoldi(meth)acrylate, triethyleneglycol di(meth)acrylate, dipropyleneglycoldi(meth)acrylate, bis(2-hydroxyethyl)isocyanurate di(meth)acrylate,hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxylbutyl(meth)acrylate, isooctyl (meth)acrylate, isodecyl (meth)acrylate,stearyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, phenoxyethyl(meth)acrylate, isoborneol (meth)acrylate and mixtures thereof. However,the acrylic monomer of the present invention is not limited to theseexamples. In other words, the acrylic monomer may include one of theknown materials used in the art.

Such an acrylic monomer may be included into the photo curable resincomposition by about 10 to about 30 wt %, when the photo curable resincomposition corresponds to 100 wt %.

Furthermore, the photo curable resin composition may include a solvent.The solvent may be an alcohol-based organic solvent. For example, thesolvent may include any one selected from a material group whichincludes dipropylene glycol (DPG); monoethylene glycol (MEG); diethyleneglycol (DEG); triethylene glycol (TEG); tripropylene glycol;1,4-butanediol (BDO); 1,5-pentanediol; 1,6-hexanediol; 1,3-propanediol;1,2-propanediol; 2,2-dimethyl-1,3-propanediol (neopentyl glycol); andmixtures thereof. However, the solvent of the present invention is notlimited to these examples. In other words, the solvent may include oneof the known materials used in the art.

The solvent is preferably included in the photo curable resincomposition by the rest of the content except the fluorinated polymer,the fluorinated silane, the cage type silsesquioxane resin, the chaintype siloxane acrylate and the photo polymerization initiator from thephoto curable resin composition.

The hard coating layer 100 may be formed from the photo curable resincomposition which includes the fluorinated polymer, the fluorinatedsilane, the cage type silsesquioxane resin, the chain type siloxaneacrylate, the photo polymerization initiator and the acrylic monomer. Inthis case, the photo curable resin composition may include about 10 toabout 20 wt % of cage type silsesquioxane resin, about 2 to about 5 wt %of chain type siloxane acrylate, about 15 to about 35 wt % offluorinated polymer, about 10 to about 15 wt % of fluorinated silane,about 1 to about 3 wt % of photo polymerization initiator, about 10 toabout 30 wt % of acrylic monomer and a remaining quantity of solvent.

The hard coating layer 100, which may be formed in a single layerstructure, may have a thickness of about 80 nm to 5 μm. The thickness ofthe hard coating layer 100 depends on reflectance and/or transmittance.

Additional embodiments of the present invention will be explained indetail. The following embodiments are provided only as examples of thepresent invention, but the present invention is not restricted by theexemplary embodiments.

First Through Fourth Embodiments

A photo curable resin composition of the first embodiment can bemanufactured to include about 25 wt % of fluorinated polymer, about 20wt % of cage type silsesquioxane resin, about 10 wt % of fluorinatedsilane, about 25 wt % of acrylic monomer, about 3 wt % of photopolymerization initiator, about 3 wt % of chain type siloxane acrylateand a residual content (about 14 wt %) of solvent.

A photo curable resin composition of the second embodiment can bemanufactured to include about 30 wt % of fluorinated polymer, about 20wt % of cage type silsesquioxane resin, about 15 wt % of fluorinatedsilane, about 15 wt % of acrylic monomer, about 3 wt % of photopolymerization initiator, about 4 wt % of chain type siloxane acrylateand a residual content (about 13 wt %) of solvent.

A photo curable resin composition of the third embodiment can bemanufactured to include 35 wt % of fluorinated polymer, 20 wt % of cagetype silsesquioxane resin, 10 wt % of fluorinated silane, 15 wt % ofacrylic monomer, 3 wt % of photo polymerization initiator, 4 wt % ofchain type siloxane acrylate and a residual content (i.e., 13 wt %) ofsolvent.

A photo curable resin composition of the fourth embodiment can bemanufactured to include about 25 wt % of fluorinated polymer, about 15wt % of cage type silsesquioxane resin, about 15 wt % of fluorinatedsilane, about 20 wt % of acrylic monomer, about 3 wt % of photopolymerization initiator, about 3 wt % of chain type siloxane acrylateand a residual content (about 19 wt %) of solvent.

The photo curable resin compositions according to the first throughfourth embodiments are regionally coated on one surface of a PMMA(polymethylmethacrylate) film. Then, the regionally coated photo curableresin compositions are hardened by irradiating UV (ultraviolet) light.

The fluorinated polymer used in the first through fourth embodiment is aurethane-modified polymer. Such a fluorinated polymer can become acompound which is represented by the following chemical formula 8. Inchemical formula 8, ‘e’ is 2 and ‘R₁₁’ is C₂H₅.

The cage type silsesquioxane resin used in the first through fourthembodiments can be a compound which is represented by the followingchemical formula 2. In chemical formula 2, ‘R2’ through ‘R8’ can becomeepoxy acrylate.

The fluorinated silane used in the first through fourth embodiments is3,3,4,4,5,5,6,6,7,7,8,8,8-tridecaflurooctyltriethoxysilane.

Comparative Embodiment

In the comparative embodiment, the PMMA (polymethylmethacrylate) film isused as is without any hard coating layer.

EXPERIMENTATION

Experiments were performed to measure contact angle with water,reflectance, pencil hardness, transmittance and haze of the hard coatinglayers, which are formed from the photo curable resin compositions ofthe first through fourth embodiments, and the PMMA film of thecomparative embodiment. The experimental resultants are shown in thefollowing table 2.

TABLE 2 Contact angle with Pencil hardness Transmittance water (°)Reflectance (%) (H) (%) Haze First 105-110 2.0 8 94.08 0.29 embodimentSecond 103-107 1.7 8-9 94.28 0.28 embodiment Third 105-110 1.5 8 94.590.21 embodiment Fourth 100-105 2.1 7-8 93.98 0.31 embodiment Comparative70-75 4.2 8-9 91.89 0.28 embodiment

As shown in table 2, it was found that the hard coating layers accordingto the first through fourth embodiments have larger contact angles withwater compared to the PMMA film of the comparative embodiment. Also, itwas found that the coated surfaces of the first through fourthembodiments have superior anti-pollution and anti-moisture propertiescompared to the surface of the PMMA film of the comparative embodiment,partly because the coated surfaces of the hard coating layers accordingto the first through fourth embodiments have smaller surface energiesthan that of the comparative embodiment and hydrophobicity. In otherwords, the hard coating layers 100 according to the embodiments of thepresent invention have superior anti-pollution and fingerprint resistantproperties.

In general, low refractive-index polymer has a lower hardness. However,it was found that the hardness of the hard coating layers according tothe first through fourth embodiments is not low. Also, it was found thatthe reflectance of the hard coating layers according to the firstthrough fourth embodiments not only decreases by at least 2% but alsothe transmittance increases by at least 2% compared to those of thecomparative embodiment. Moreover, it was found that the amount of hazein the first through fourth embodiment is in an acceptable range.

The hard coating layer according the related art includes a plurality oflayers to satisfy reflectance requirement. In the related art, aplurality of high refractive-index layers and a plurality of lowrefractive-index layers are repeatedly stacked on the hard coating layerby the dry method, or a low refractive-index layer is formed on the hardcoating layer by the wet method. Thus, the manufacture procedure iscomplicated. Also, the dry method is limited by the number of panels andthe size of the panels, leading to lengthened process time. The wetmethod weakens an adhesion force between the low refractive-index layerand the hard coating layer, which causes the low refractive-index layerto be easily peeled from the hard coating layer.

However, the hard coating layer 100 according to an embodiment of thepresent invention can obtain a desired reflectance without stacking aplurality of layers. Also, because the hard coating layer 100 may beformed in a single layer structure, the manufacture procedure can besimplified, with process time and costs being reduced. Moreover, thehard coating layer 100 can provide a superior scratch resistance andanti-reflective effect.

The display panel 300 may be any one of an LCD panel, an OLED panel, andthe like. An embodiment where the LCD panel is used as the display panel300 will now be explained with reference to FIG. 2.

As illustrated in FIG. 2, an LCD panel is used as the display panel 300.The LCD panel 300 is fabricated by combining a first substrate 301 and asecond substrate 302 with a liquid crystal layer 380 between the twosubstrates 301 and 302. The hard coating layer 100 is formed by acoating method on an external surface of the first or second substrate301 or 302 of the LCD panel 300.

Although not shown in the drawings, a backlight unit is disposed underthe LCD panel 300. Also, in order to provide a polarization function tothe LCD panel 300, at least one polarizer not shown in the drawings canbe included into the LCD panel 300.

The LCD panel 300 can be defined into a display area and a non-displayarea. Gate lines and data lines are formed on one surface of the firstsubstrate 301, with a gate insulation film 352 therebetween. The gatelines and the data lines cross each other and define pixel regions. Eachof the pixel regions includes a thin film transistor TFT. The thin filmtransistor TFT is connected to a pixel electrode 357 within therespective pixel region through a contact hole that is formed in apassivation layer 356. The first substrate 301 with the above-mentionedstructure can be used as a thin film transistor substrate.

The thin film transistor TFT includes a gate electrode 351, the gateinsulation film 352, a semiconductor layer 353, a source electrode 354and a drain electrode 355. As illustrated in FIG. 2, the thin filmtransistor TFT is formed in a bottom gate structure in which the gateelectrode 351 is disposed under the semiconductor layer 353.Alternatively, the thin film transistor TFT can be formed in a top gatestructure in which the gate electrode 351 is disposed above thesemiconductor layer 353. In other words, structures and other featuresof the thin film transistor TFT can be variously changed and modifiedwithout departing from the technical spirit of the present invention.

A black matrix 371 with a lattice structure is formed on one surface ofthe second substrate 302 of the LCD panel 300. The black matrix 371covers the non-display area including the thin film transistors and thelike of the first substrate 301 and surrounds each of the pixel regions.Also, a color filter layer 372 is formed in the pixel regions that aredefined by the lattice structure of the black matrix 371. The colorfilter layer 372 includes red, green and blue color filters that may bearranged alternately with one another in the pixel regions. Moreover, acommon electrode 373 is formed in such a manner as to cover the blackmatrix 371 and the color filter layer 372. The second substrate 302 withthe above-mentioned structure can be used as a color filter substrate.

A first alignment film 358 is disposed between the liquid crystal layer380 and the pixel electrode 357. Also, a second alignment film 374 isdisposed between the liquid crystal layer 380 and the common electrode373. The first and second alignment films 358 and 374 can be used to setan initial alignment state of liquid crystal molecules and uniformlyalign the liquid crystal molecules in a desired alignment direction.

For easy of description, the LCD panel according to the embodiment ofthe present invention has a simplified configuration, but it is notlimited to these examples. For example, each of the pixel regionsincludes only a single thin film transistor in this embodiment. However,at least two thin film transistors can be included in each of the pixelregions depending on the driving characteristics of the LCD panel.

The alignment of the liquid crystal molecules can be controlled by avariety of alignment control methods. For example, a twisted nematic(TN) mode, a vertical alignment (VA) mode, an in-plane switching (IPS)mode, a fringe field switching (FFS) mode and the like can be used tocontrol the alignment of the liquid crystal molecules. As such, althoughthe pixel electrode 357 formed on the first substrate 301 and the commonelectrode 373 formed on the second substrate 302 are illustrated in FIG.2, the configuration of the pixel electrode 357 and the common electrode373 can be modified and altered depending on the operation mode. Forexample, the pixel electrode 357 and the common electrode 373 can beformed together on the first substrate 301 in the LCD panel of the IPS(In-Plane Switching) mode or the FFS (Fringe Field Switching) mode.

Also, the LCD panel 300 can be manufactured in a COT (color filter ontransistor) structure. The LCD panel 300 having the COT structure can beprepared by forming thin film transistors, color filter layer and blackmatrix on the first substrate 301 and combining the first substrate 301and the second substrate 302, with a liquid crystal layer therebetween.In detail, the thin film transistors can be formed on the firstsubstrate 301, a passivation layer can be formed on an entire surface ofthe first substrate 301 provided with the thin film transistors, and thecolor filter layer can be formed on the passivation layer. Also, pixelelectrodes contacting the respective thin film transistors can be formedon the first substrate 301. However, the black matrix can be omitted inorder to enhance the aperture ratio of the LCD panel and simplify themask procedures. In this case, the common electrode can be formed on thesecond substrate 302 in such a manner as to also serve as the blackmatrix.

In other words, the configuration of the LCD panel 300 is limited towhat is illustrated in FIG. 2. As such, the configuration of thin filmtransistor and the like can be variously modified and altered.

An OLED panel used as the display panel will now be described withreference to FIG. 3.

As illustrated in FIG. 3, the display panel 300 may be an OLED panel.The OLED panel 300 includes a first substrate 301, in which thin filmtransistors TFT and organic light-emitting elements OL electricallyconnected to the respective thin film transistors TFT are formed, and asecond substrate 302 used to protect the organic light-emitting elementsOL. In this case, the hard coating layer 100 may be formed on anexternal surface of the first or second substrate 301 or 302 of the OLEDpanel 300 through a coating process.

The OLED panel 300 can further include a sealing layer 324 formedbetween the first substrate 301 and the second substrate 302. Althoughthe sealing layer 324 illustrated in FIG. 3 is formed in a single layerstructure, the sealing layer 324 can be formed in a multi-layeredstructure including a protective layer, an adhesive layer and so on.Also, the OLED panel 300 can include at least one polarizer with apolarization function even though it is not shown in the drawings.

The OLED panel 300 can be defined into a display area and a non-displayarea. The thin film transistors TFT are formed on one surface of thefirst substrate 301 in the display area of the OLED panel 300. Each ofthe thin film transistors TFT is formed to include a semiconductor layer311, a gate electrode 313, a source electrode 315 and a drain electrode316.

In detail, the semiconductor layer 311 including a source domain 311 a,a channel domain 311 b and a drain domain 311 c is formed on the firstsubstrate 301. A gate insulation film 312 is formed on an entire surfaceof the first substrate 301 provided with the semiconductor layer 311. Agate line (not shown) and the gate electrode 313 branched off the gateline are formed on the gate insulation film 312. An interlayerinsulation film 314 is formed on the gate insulation film 312 providedwith the gate line and the gate electrode 313.

Also, a data line (not shown), the source electrode 315 branched off thedata line and the drain electrode 316 separated from the sourceelectrode 315 by a fixed distance are formed on the interlayerinsulation film 314. The data line crosses the gate line with theinterlayer insulation film 314 therebetween, which defines pixelregions. The source electrode 315 and the drain electrode 316 come incontact with the source domain 311 a and the drain domain 311 c of thesemiconductor layer 311 via respective first contact holes which areformed to sequentially penetrate through the interlayer insulation film314 covering the gate electrode 313 and the gate insulation film 312.

A passivation layer 317 is formed on an entire surface of the firstsubstrate 301 provided with the source and drain electrodes 315 and 316,and a second contact hole exposing the drain electrode 316 is formed inthe passivation layer 317. The exposed drain electrode 316 iselectrically connected to a connection electrode 318 which is formed onthe passivation layer 317. A planarization film 319 is formed on anentire surface of the first substrate 301 provided with the thin filmtransistor TFT, and a third contact hole exposing the connectionelectrode 318 is formed in the planarization film 319.

The organic light-emitting element OL, which is electrically connectedto the thin film transistor TFT via the third contact hole formed in theplanarization film 319, is formed on the first substrate 301. Theorganic light-emitting element OL includes a lower electrode 320, anorganic emission layer 322 and an upper electrode 323.

More specifically, the lower electrode 320, which is electricallyconnected to the connection electrode 318, is formed on theplanarization film 319. Although the lower electrode 320 of the organiclight-emitting element OL illustrated in FIG. 3 is electricallyconnected to the drain electrode 315 of the thin film transistor TFT viathe connection electrode 318, the connection electrode 318 may beremoved from the OLED panel 300. In such a case, the lower electrode 320of the organic light-emitting element OL may be formed on theplanarization film 319 in such a manner as to directly contact the drainelectrode 315 of the thin film transistor TFT via a contact hole formedin the planarization film 319. As such, the passivation layer 317 may bealso removed from the OLED panel 300.

A bank pattern 321 exposing the lower electrode 320 by a pixel regionsize is formed on the planarization film 319 provided with the lowerelectrode 320. The organic emission layer 322 is formed on the exposedlower electrode 320. The organic emission layer 322 may be a singlelayer formed from an emission material. Alternatively, the organicemission layer may have a multi-layer structure with, for example, ahole injection layer, a hole transport layer, an emission materiallayer, an electron transport layer and an electron injection layer.

The upper electrode 323 is formed on the organic emission layer 322. Ifthe lower electrode 320 is used as an anode electrode, the upperelectrode 323 should be used as a cathode electrode. On the other hand,the upper electrode 323 should be used as an anode electrode, when thelower electrode 320 is used as a cathode electrode.

A sealing member is formed on the first substrate 301 provided with thethin film transistors TFT and the organic light-emitting elements OL.For example, the sealing member may be configured with the sealing layer324 and the second substrate 302. In this case, the sealing layer 324used to protect the display elements (i.e., the organic light-emittingelements OL) is formed on an entire surface of the first substrate 301provided with the upper electrode 323. The sealing layer 324 can beformed in a multi-layer structure. The second substrate 302 can becombined with the sealing layer 324. The second substrate 302 can be asealing substrate used to encapsulation of the first substrate 301.However, the sealing member disposed on the first substrate 301 is notlimited to the combination of the sealing layer 324 and the secondsubstrate 302 as illustrated in FIG. 3. In other words, a variety ofdifferent sealing members known to a person of ordinary skill in the artcan be used to prevent or minimize the intrusion of oxygen, moisture andthe like.

Configurations of the display devices according to the present inventionare not limited to what are illustrated in the drawings. In other words,a person of ordinary skill in the art would appreciate that the displaydevices according to the embodiments of the present invention can bevariously modified and altered.

A display device according to the second embodiment of the presentinvention will now be described with reference to FIG. 4. FIG. 4 is across-sectional view illustrating a display device according to thesecond embodiment of the present invention.

The display device according to the second embodiment of the presentdisclosure can have the same or similar configuration as that of thefirst embodiment, with variations in parts. As such, the description ofthe second embodiment that is the same or similar to the firstembodiment will be omitted. Also, the components of the secondembodiment that have the same or similar function and shape as those ofthe first embodiment will be referred to by the same reference numbersand names.

Referring to FIG. 4, the display device according to the secondembodiment of the present invention includes a base substrate 200between a display panel 300 and a hard coating layer 100. In detail, thebase substrate 200 is formed on the display panel 300, and the hardcoating layer 100 is formed on the base substrate 200. The hard coatinglayer 100 can be prepared by performing a coating process for an uppersurface of the base substrate 200. The hard coating layer 100 and thedisplay panel 300 can be the same as those of the first embodiment.

The base substrate 200 may be a polarizing plate. For example, the basesubstrate 200 can be either a linear polarizing plate or an externallight anti-reflection type polarizing plate. If the display panel 300 isan LCD panel, the base substrate 200 can become the linear polarizingplate. Alternatively, when the display device is an OLED panel, the basesubstrate 200 can become the external light anti-reflection typepolarizing plate.

Although the base substrate 200 is disposed on the display panel 300 asillustrated in FIG. 4, the base substrates 200 may be disposed on boththe upper and lower surfaces of the display panel 300, when the basesubstrates 200 are the polarizing plates. For example, when the displaypanel 300 is an LCD panel, the base substrates 200 of a linearpolarizing plate can be disposed on the upper and lower surfaces of thedisplay panel 300. In such a case, the hard coating layer 100 can beformed on the base substrate 200 disposed on the upper surface of thedisplay panel 300.

Alternatively, the base substrate 200 can be a transparent substrate. Assuch, light can pass through the base substrate 200 without anypolarization. In this case, the base substrate 200 can be formed fromeither a glass or plastic material. For example, the base substrate 200can be formed from any one selected from a material group which includesglass, a cellulose esters (such as cellulose triacetate, cellulosepropionate, cellulose butyrate, cellulose acetate propionate andnitrocellulose), polyimide, polycarbonate, polyesters (such aspolyethylene terephthalate, polyethylene naphthalate,poly-1,4-cyclohexanedimethylane terephthalate, polyethylene1,20diphenoxyethane-4,4′-dicarboxylate and polybutylene terephthalate),a polystylene (such as syndiotactic polystylene), polyolefines (such aspolypropylene, polyethylene and polymethylpentene), polysulfone,polyether sulfone, polyarylate, polyether-imide, polymethylmethacrylate, polyether ketone, polyvinyl alcohol and polyvinyl alcohol.However, the types of the base substrate 200 are not limited to theseexamples. In other words, a variety of different substrates or films canbe used as the base substrate 200, so long as they do not substantiallycompromise transparency.

Although not shown in the drawings, if the base substrate 200 is used asa transparent substrate without polarization, the hard coating layer 100can be formed both surfaces of the base substrate 200. The hard coatinglayers 100 formed on both surfaces of the base substrate 200 can have areflectance less than about 4%.

A display device according to the third embodiment of the presentinvention will now be described with reference to FIGS. 5 to 7. FIG. 5is a cross-sectional view illustrating a display device according to thethird embodiment of the present invention. FIGS. 6 and 7 are viewsillustrating a touch panel of the display device according to the thirdembodiment of the present invention.

The display device according to the third embodiment of the presentdisclosure can have the same or similar configuration as those of thefirst and second embodiments, with variations in parts. As such, thedescription of the third embodiment that is the same or similar to thefirst and second embodiments will be omitted. Also, the components ofthe third embodiment that have the same or similar function and shape asthose of the first and second embodiments will be referred to by thesame reference numbers and names.

Referring to FIG. 5, the display device according to the thirdembodiment of the present disclosure includes a display panel 300 and atouch panel 400 disposed on the display panel 300. Also, the displaydevice includes a base substrate 200 disposed on the touch panel 400. Inother words, the touch panel 400 can be disposed between the basesubstrate 200 and the display panel 300.

As illustrated in FIG. 5, the touch panel 400 can be prepared in such amanner as to be separated from the base substrate 200 and the displaypanel 300. However, the touch panel 400 can be formed in a single bodyunited with the base substrate 200. Alternatively, the touch panel 400can be formed in a single body united with the display panel 300. Inother words, the touch panel 400 can be an add-on type touch panel 400.

Alternatively, the touch panel 400 may be an integrated type touch panel400. If the touch panel 400 is an add-on type touch panel 400, the touchpanel 400 is prepared in such a manner as to be separate from thedisplay panel 300. In such a case, a transparent adhesive layer may beformed between the touch panel 400 and the display panel 300.

In this case, the touch panel 400 can be prepared in such a manner as tobe separated from the base substrate 200 or united with the basesubstrate 200. If the touch panel 400 and the base substrate 200 areseparated from each other, another transparent adhesive layer may beformed between the base substrate 200 and the touch panel 400. On theother hand, when the touch panel 400 is united with the base substrate200 in a single body, sensing electrodes and the like may be formed on arear surface of the base substrate 200. In such a case, it is notnecessary to form an additional adhesive layer between the basesubstrate 200 and the touch panel 400.

When the touch panel 400 is an integrated type touch panel 400, thetouch panel 400 can be formed in a single body united with the displaypanel 300. In such a case, it is not necessary to interpose any adhesivelayer between the display panel 300 and the touch panel 400.

The touch panel 400 can be formed in one of an on-cell type and anin-cell type.

If the touch panel 400 is the on-cell type, sensing electrodes and thelike can be formed on the upper surface of the display panel 300. Indetail, the sensing electrodes and the like can be formed directly on anupper substrate of the display panel 300. Also, the touch panel 400 canbe formed in such a manner as to be separate from the base substrate200, like the add-on type touch panel 400. Alternatively, the on-celltype touch panel 400 can be formed in a single body united with the basesubstrate 200.

When the touch panel 400 is the in-cell type, sensing electrodes and thelike can be formed between the first and second substrates of thedisplay panel 300. In other words, the sensing electrodes and the likecan be formed when display elements are formed in the display panel 300.In such a case, the base substrate 200 may be prepared in such a manneras to be separate from the touch panel 400, and a transparent adhesivelayer may also be formed between the base substrate 200 and the displaypanel 300.

The touch panel 400 will be described in detail with reference to FIGS.6 and 7. FIGS. 6 and 7 illustrate examples of an add-on type touch panelthat is separate from the base substrate 200. However, the touch panel400 of the present invention is not limited to the configurationsillustrated in FIGS. 6 and 7. In other words, other types of touchpanels including the above-mentioned add-on and integrated types can beapplied to the touch panels illustrated in FIGS. 6 and 7.

Referring to FIGS. 6 and 7, touch panels 400 can be each defined into adisplay area AA transmitting light and a non-display area IAintercepting light. The display area AA is used to receive inputsthrough a touch of a user. Unlike the display area AA, the non-displayarea IA may not be used for receiving inputs because it may not beactivated through a touch of a user.

As illustrated in FIG. 6, the touch panel 400 may include sensingelectrodes 410 and scan lines 420 that are arranged on one surface of atouch substrate 401. The touch substrate 401 may be one of temperedglass, heat strengthened glass, soda-lime glass, reinforced plastic andflexible plastic, but it is not limited to these examples.

The sensing electrodes 410 are arranged on the display area AA, and thescan lines 420 are arranged on the non-display area IA. Although notillustrated in the drawing, a printed layer is additionally formed inthe non-display area IA of the touch substrate 401. In this case, thescan lines 420 can be formed on the printed layer.

The sensing electrodes 410 may include a conductive material. Forexample, the sensing electrodes 410 can include any one selected from amaterial group which includes a transparent conductive material, ametal, nano-wire, a sensitive nano-wire film, carbon nanotube, grapheme,conductive polymer and mixture thereof.

The sensing electrodes 410 includes first sensing electrodes 411 andsecond sensing electrodes 412. The first sensing electrodes 411 and thesecond sensing electrodes 412 can include the same material or differentmaterials from each other. Also, the first sensing electrodes 411 andthe second sensing electrodes 412 can be arranged on the same surface ofthe touch substrate 401.

In case where the first sensing electrodes 411 and the second sensingelectrodes 412 are arranged on the same surface of the touch substrate401, the first sensing electrodes 411 and the second sensing electrodes412 are formed without contacting each other. To this end, an insulationlayer and bridge electrodes can be formed on the display area AA.

In detail, one side of the first sensing electrodes 411 and the secondsensing electrodes 412 arranged under the insulation layer can be formedin such as a manner as to be electrically connected to one another,respectively. The other side can be formed with being connected to thebridge electrodes formed on the insulation layer, and electricallyconnected to one another, respectively. As such, the first sensingelectrodes electrically connected to one another can be isolated fromthe second sensing electrodes 412 by the insulation layer and the bridgeelectrodes. Also, the first sensing electrodes 411 can be electricallyconnected to one another by the bridge electrodes.

The first and second sensing electrodes 411 and 412 arranged on thedisplay area AA can be used to sense a touch. To this end, the firstsensing electrodes 411 may be connected to one another in one direction(for example, a horizontal direction), and the second sensing electrodes412 may be connected to one another in a different direction (forexample, a vertical direction).

The scan lines 420 may include first scan lines 421 and second scanlines 422. In detail, the scan lines 420 can include the first scanlines 421 connected to the first sensing electrodes 411, and the secondscan lines 422 connected to the second sensing electrodes 412.

The first scan lines 421 and the second scan lines 422 may be connectedto a printed circuit board (not shown). In other words, the first scanlines 421 and the second scan lines 422 transfer touch signals sensed bythe first sensing electrodes 411 and the second sensing electrodes 412to the printed circuit board (not shown) loaded with a driver chip (notshown), which allows a touch detecting operation to be performed. Theprinted circuit board (not shown) may be a flexible printed circuitboard (FPCB) as an example.

The first scan lines 421 and the second scan lines 422 may include aconductive material. For example, the first scan lines 421 and thesecond scan lines 422 can include a metal material such as silver (Ag),copper (Cu) or others.

Although not shown in the drawings, a passivation layer may further beformed on the touch substrate 401 provided with the scan lines 420. Thepassivation layer (not shown) can protect the scan lines 420. In detail,the passivation layer (not shown) can prevent the scan lines 420 frombeing exposed to and oxidized by oxygen. Also, the passivation layer(not shown) can prevent reliability deterioration due to moistureintrusion.

Referring to FIG. 7, the touch panel 400 may include a first touchsubstrate 402 and a second touch substrate 403. The first touchsubstrate 402 and the second touch substrate 403 each can include one oftempered glass, heat strengthened glass, soda-lime glass, reinforcedplastic and flexible plastic, but they are not limited to theseexamples. Also, the first touch substrate 402 and the second touchsubstrate 403 can be combined with each other using a transparentadhesive such as an optically clear adhesive or others.

First sensing electrodes 411 can be arranged in the display area AA ofthe first touch substrate 402. Also, first scan lines 421 can bearranged in the non-display area IA of the first touch substrate 402.The first scan lines 421 are connected to the respective first sensingelectrodes 411.

On the other hand, second sensing electrodes 412 can be arranged in thedisplay area AA of the second touch substrate 403. Also, second scanlines 422 can be arranged in the non-display area IA of the second touchsubstrate 403. The second scan lines 422 are connected to the respectivesecond sensing electrodes 412. The first scan lines 421 and the secondscan lines 422 can be electrically connected to a printed circuit board(not shown).

However, the touch panel 400 according to an embodiment of the presentdisclosure is not limited to the drawings and the description providedabove. In other words, any input device capable of receiving inputs bytouching a finger, a stylus pen or others on a front surface of adisplay device can be used as the touch panel 400 according to anembodiment of the present invention. Any touch panel being generallyused by the public can be applied as the touch panel 400 according to anembodiment of the present invention.

The display panel 300 according to an embodiment of the presentinvention can be the same as those described in the above embodiments.For example, the display panel 300 can be one of an LCD panel and anOLED panel. Also, the hard coating layer 100 according to an embodimentof the present invention can be the same as those described in the aboveembodiments.

Also, the base substrate 200 according to an embodiment of the presentinvention can be the same as that of the second embodiment.Beneficially, the base substrate 200 disposed on the touch panel 400 isa transparent substrate. In such a case, the base substrate 200 cantransmit light without any polarization. The base substrate 200 may beformed from one of glass and a plastic material.

Although not shown in the drawings, the hard coating layer 100 accordingto an embodiment of the present invention can be formed on both sides ofthe base substrate 200 when the base substrate 200 is a transparentsubstrate that transmits light without any polarization. In other words,the hard coating layer 100 according to an embodiment of the presentinvention can be formed on a lower surface and an upper surface of thebase substrate 200. The hard coating layers formed on both sides of thebase substrate 200 each can have reflectance below about 4%.

It will be apparent to those skilled in the art that variousmodifications and variation can be made in the present invention withoutdeparting from the spirit or scope of the invention. Thus, it isintended that the present invention cover the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

What is claimed is:
 1. A method for manufacturing a display device, themethod comprising: forming a display panel; and forming a hard coatinglayer on the display panel from a photo curable resin composition thatincludes a fluorinated polymer that comprises a compound unitrepresented by Chemical Formula 8 and a fluorinated silane comprising acompound unit represented by Chemical Formula 9:

d is an integer from 1 to 10, e is an integer from 0 to 10, x is aninteger of at least 1, and R₁₁ is hydrogen or an alkyl group having 1 to4 carbon atoms,

wherein f is an integer from 0 to 10, g is an integer from 1 to 10, R₁₂to R₁₄ are individually an alkyl group having 1 to 4 carbon atoms, andR₁₂ to R₁₄ may be the same or different, wherein the fluorinated polymeris included into the photo curable resin composition by about 15 toabout 35 wt %, and wherein the fluorinated silane is included into thephoto curable resin composition by about 10 to about 15 wt %.
 2. Themethod according to claim 1, wherein the photo curable resin compositionfurther includes a cage type silsesquioxane resin that includes acompound unit represented by Chemical Formula 1:[R₁—SiO_(3/2)]_(n) wherein n is an integer from 6 to 18, and R₁ isselected from materials which are represented by Chemical Formulas 3through 6:

wherein m is an integer from 1 to 20, and R₁₀ is an aliphatic oraromatic hydrocarbon having 1 to 80 carbon atoms.
 3. The methodaccording to claim 2, wherein n in chemical formula 1 is 12 and the cagetype silsesquioxane resin is formed in a hexagonal structure.
 4. Themethod according to claim 2, wherein the cage type silsesquioxane resinis included into the photo curable resin composition by about 10 toabout 20 wt %.
 5. The method according to claim 1, wherein the photocurable resin composition includes a chain type siloxane acrylate thatincludes a compound unit represented by Chemical Formula 7:

wherein a is an integer from 0 to 1000, b is an integer from 1 to 30 andc is an integer from 1 to
 25. 6. The method according to claim 5,wherein the chain type siloxane acrylate is included into the photocurable resin composition by about 2 to about 4 wt %.
 7. The methodaccording to claim 1, wherein a mole fraction of fluorine is in a rangeof 17 to 25 when a mole fraction of the photo curable resin compositionis
 100. 8. The method according to claim 1, wherein the photo curableresin composition includes a photo polymerization initiator.
 9. Themethod according to claim 1, wherein the photo curable resin compositionincludes an acrylic monomer.
 10. The method according to claim 1,wherein the hard coating layer have a pencil hardness of at least 6H.11. The method according to claim 1, wherein a contact angle of the hardcoating layer is in a range between about 100° and 130°.